The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2024

Filed:

Jul. 26, 2022
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Yen-Hsung Ho, Taoyuan County, TW;

Chia-Yi Tseng, Tainan, TW;

Chih-Hsun Lin, Tainan, TW;

Kun-Tsang Chuang, Miaoli County, TW;

Yung-Lung Hsu, Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/544 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); H01L 22/14 (2013.01); H01L 22/34 (2013.01); H01L 23/5226 (2013.01); H01L 23/544 (2013.01); H01L 29/401 (2013.01);
Abstract

A method includes following steps. An image of a wafer is captured. A first contact region in the captured image at which the first conductive contact is rendered is identified. A second contact region in the captured image at which the second conductive contact is rendered is identified. The second conductive contact is determined as not shorted to the first conductive contact, in response to the identified second contact region in the captured image is darker than the identified first contact region in the captured image.


Find Patent Forward Citations

Loading…