The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2024

Filed:

Apr. 29, 2021
Applicant:

Toyoda Gosei Co., Ltd., Kiyosu, JP;

Inventors:

Toru Oka, Kiyosu, JP;

Tsutomu Ina, Kiyosu, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/08 (2006.01); H01L 29/20 (2006.01); H01L 29/24 (2006.01); H01L 29/423 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0843 (2013.01); H01L 29/2003 (2013.01); H01L 29/24 (2013.01); H01L 29/4236 (2013.01);
Abstract

The present invention provides a semiconductor device in which the contact resistance of the body electrode is reduced without reducing the channel mobility. The p-type layer is a Mg-doped p-GaN layer deposited on the first re-type layer. The p-type layer has a two-layer structure in which a first p-type layer and a second p-type layer are sequentially deposited. The second p-type layer has a Mg concentration higher than the Mg concentration of the first p-type layer. The recess is formed in a predetermined position on the surface of the second n-type layer, and has a depth passing through the second n-type layer and reaching the second p-type layer. The body electrode is formed on the bottom surface of the recess in contact with the p-type layer exposed thereon.


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