The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2024

Filed:

Jun. 06, 2019
Applicant:

Showa Denko Materials Co., Ltd., Tokyo, JP;

Inventors:

Yuya Otsuka, Tokyo, JP;

Hisataka Minami, Tokyo, JP;

Shingo Kobayashi, Tokyo, JP;

Mayumi Komine, Tokyo, JP;

Hisato Takahashi, Tokyo, JP;

Assignee:

RESONAC CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); H01L 21/3105 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); H01L 21/31053 (2013.01);
Abstract

A polishing liquid containing: abrasive grains containing a metal oxide; at least one hydroxy acid compound selected from the group consisting of a hydroxy acid having a structure represented by General Formula (A1) below and a salt thereof; and water: [In the formula, Rrepresents a hydrogen atom or a hydroxy group, Rrepresents a hydrogen atom, an alkyl group, or an aryl group, n11 represents an integer of 0 or more, and n12 represents an integer of 0 or more; however, a case where both of Rand Rare a hydrogen atom is excluded.]


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