The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2024
Filed:
Dec. 08, 2021
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventor:
Bret Johnson, Folsom, CA (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 8/18 (2006.01); G06F 3/06 (2006.01); G11C 7/10 (2006.01); G11C 8/06 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0656 (2013.01); G11C 7/1057 (2013.01); G11C 7/1063 (2013.01); G11C 8/06 (2013.01); G11C 8/18 (2013.01);
Abstract
Methods, apparatuses, and systems related to die-to-die communications are described. An apparatus may include an interfacing die and at least one additional die communicatively coupled to each other through an internal bus. The interfacing die may be configured to provide a combined external interface for the coupled dies. For the die-to-die communications, a target die may coordinate transfer of communicated data to the internal interface according to a timing signal generated by a source external to the at least one additional die.