The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2024
Filed:
Jul. 06, 2021
Applicant:
Asml Netherlands B.v., Veldhoven, NL;
Inventors:
Sarathi Roy, Eindhoven, NL;
Edo Maria Hulsebos, Waalre, NL;
Roy Werkman, Eindhoven, NL;
Junru Ruan, Beaverton, OR (US);
Assignee:
ASML NETHERLANDS B.V., Veldhoven, NL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05B 19/418 (2006.01); G03F 7/00 (2006.01); G05B 13/02 (2006.01); G06N 3/044 (2023.01);
U.S. Cl.
CPC ...
G05B 19/41875 (2013.01); G03F 7/70508 (2013.01); G03F 7/70525 (2013.01); G05B 13/027 (2013.01); G05B 19/41885 (2013.01); G06N 3/044 (2023.01); G05B 2219/33025 (2013.01); G05B 2219/45028 (2013.01); G05B 2219/45031 (2013.01);
Abstract
A method for configuring a semiconductor manufacturing process, the method including: obtaining a first value of a first parameter based on measurements associated with a first operation of a process step in the semiconductor manufacturing process and a first sampling scheme; using a recurrent neural network to determine a predicted value of the first parameter based on the first value; and using the predicted value of the first parameter in configuring a subsequent operation of the process step in the semiconductor manufacturing process.