The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2024
Filed:
Mar. 10, 2021
Ebara Corporation, Tokyo, JP;
Kazuhito Tsuji, Tokyo, JP;
EBARA CORPORATION, Tokyo, JP;
Abstract
Provided is a technique that allows a removal of air bubbles that remain on an ionically resistive element. A plating apparatusincludes a plating tankconfigured to accumulate a plating solution Ps and including an ionically resistive elementarranged in the plating tank, a substrate holderarranged above the ionically resistive element and configured to hold a dummy substrate Wfx, a rotation mechanismconfigured to rotate the substrate holder, and an elevating mechanismconfigured to elevate the substrate holder. At least one projecting portion is disposed on a lower surface of the dummy substrate. The at least one projecting portionprojects downward from the lower surface. The substrate holder includes a ringprojecting below an outer peripheral edge of the lower surface of the dummy substrate. The projecting portion has a lower surface positioned below a lower surface of the ring. The plating apparatus is configured to cause the rotation mechanism to rotate the substrate holder in a state where the elevating mechanism moves down the substrate holder to allow the projecting portion of the dummy substrate to be positioned above the ionically resistive element and to be immersed in the plating solution of the plating tank.