The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2024

Filed:

Dec. 08, 2020
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Shuji Uozumi, Tokyo, JP;

Toru Maruyama, Tokyo, JP;

Mitsunori Komatsu, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 55/03 (2006.01); B24B 37/015 (2012.01); B24B 37/20 (2012.01);
U.S. Cl.
CPC ...
B24B 55/03 (2013.01); B24B 37/015 (2013.01); B24B 37/20 (2013.01);
Abstract

A system () includes a heat exchanging member () and a liquid supply unit (). The liquid supply unit () includes a pump device () that adjusts the flow amount of a liquid flowing through a heating liquid supply line (HSL), a needle valve (MNV) that is attached to a cooling liquid supply line (CSL), and a control device () that controls operations of the pump device () and the needle valve (MNV).


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Uozumi, Shuji. (2024). System for adjusting pad surface temperature and polishing apparatus (U.S. Patent No. 11992915). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11992915

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