The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2024
Filed:
Jan. 08, 2021
Applicant:
Ev Group E. Thallner Gmbh, St. Florian am Inn, AT;
Inventor:
Markus Wimplinger, Ried in Kreis, AT;
Assignee:
EV Group E. Thallner GmbH, St. Florian am Inn, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/00 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01); H05K 13/04 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 24/74 (2013.01); H01L 24/75 (2013.01); H01L 24/80 (2013.01); H01L 25/0652 (2013.01); H05K 13/0404 (2013.01); H01L 2224/80003 (2013.01); H01L 2224/80011 (2013.01); H01L 2224/80013 (2013.01); H01L 2224/80894 (2013.01);
Abstract
A method and device for bonding chips onto a substrate or onto further chips. The chips are bonded onto the substrate or the further chips by means of a direct bond using a bond head having a first surface configured to couple to a chip that is to be bonded, and a second surface fixed to and disposed opposite the first surface. A first spring element having a first spring constant and a second spring element having a second spring constant are coupled to the second surface, where the first spring constant is different from the second spring constant.