The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2024

Filed:

Mar. 16, 2020
Applicant:

Shin-etsu Handotai Co., Ltd., Tokyo, JP;

Inventors:

Junya Ishizaki, Takasaki, JP;

Shogo Furuya, Takasaki, JP;

Tomohiro Akiyama, Annaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/02 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2023.01); H01L 31/18 (2006.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 24/24 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 24/94 (2013.01); H01L 31/02008 (2013.01); H01L 31/1876 (2013.01); H01L 31/1892 (2013.01); H01L 24/82 (2013.01); H01L 31/1844 (2013.01); H01L 2224/24146 (2013.01); H01L 2224/245 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/73217 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/82106 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/92144 (2013.01); H01L 2224/92244 (2013.01);
Abstract

The present invention is a method for producing an electronic device having a drive circuit including a solar cell structure, the method including the steps of: obtaining a bonded wafer by bonding a first wafer having a plurality of independent solar cell structures including a compound semiconductor, the solar cell structures being formed on a starting substrate by epitaxial growth, and a second wafer having a plurality of independent drive circuits formed, so that the plurality of solar cell structures and the plurality of drive circuits are respectively superimposed; wiring the bonded wafer so that electric power can be supplied from the plurality of solar cell structures to the plurality of drive circuits respectively; and producing an electronic device having the drive circuit including the solar cell structure by dicing the bonded wafer. This provides a method for producing an electronic device including a drive circuit and a solar cell structure in one chip and having a suppressed production cost.


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