The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2024
Filed:
Feb. 25, 2022
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventors:
Li-Chieh Hung, Kaohsiung, TW;
Hung-Chun Kuo, Kaohsiung, TW;
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/48 (2006.01); H01L 23/50 (2006.01); H01L 23/538 (2006.01); H01L 25/18 (2023.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3677 (2013.01); H01L 23/481 (2013.01); H01L 23/50 (2013.01); H01L 23/5385 (2013.01); H01L 23/5387 (2013.01); H01L 25/18 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/17181 (2013.01);
Abstract
An electronic device is provided. The electronic device includes an electronic component and a heat dissipation structure. The electronic component has a passive surface and a plurality of conductive vias exposed from the passive surface. The heat dissipation structure is disposed on the passive surface and configured to transmit a plurality of independent powers to the conductive vias through the passive surface.