The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2024
Filed:
Aug. 12, 2021
Micron Technology, Inc., Boise, ID (US);
Xiaosong Zhang, Boise, ID (US);
Yongjun J. Hu, Boise, ID (US);
David A. Kewley, Boise, ID (US);
Md Zahid Hossain, Boise, ID (US);
Michael J. Irwin, Boise, ID (US);
Daniel Billingsley, Meridian, ID (US);
Suresh Ramarajan, Boise, ID (US);
Robert J. Hanson, Boise, ID (US);
Biow Hiem Ong, Singapore, SG;
Keen Wah Chow, Singapore, SG;
Abstract
An apparatus comprises a structure including an upper insulating material overlying a lower insulating material, a conductive element underlying the lower insulating material, and a conductive material comprising a metal line and a contact. The conductive material extends from an upper surface of the upper insulating material to an upper surface of the conductive element. The structure also comprises a liner material adjacent the metal line. A width of an uppermost surface of the conductive material of the metal line external to the contact is relatively less than a width of an uppermost surface of the conductive material of the contact. Related methods, memory devices, and electronic systems are disclosed.