The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2024

Filed:

Oct. 29, 2020
Applicant:

Yangtze Memory Technologies Co., Ltd., Wuhan, CN;

Inventors:

Jianzhong Wu, Wuhan, CN;

Jingjing Geng, Wuhan, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/11582 (2017.01); H10B 43/27 (2023.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H10B 43/27 (2023.02); H01L 21/0223 (2013.01); H01L 21/02255 (2013.01);
Abstract

Three-dimensional (3D) memory devices and methods for forming the 3D memory devices are provided. In one example, a 3D memory device includes a substrate and a memory stack including interleaved conductive layers and dielectric layers on the substrate. The memory stack includes a core structure and a staircase structure. The staircase structure is on one side of the memory stack. The 3D memory device also includes a dummy channel structure extending vertically through the staircase structure. The dummy channel structure includes a plurality of sections along a vertical side of the dummy channel structure. The plurality of sections respectively interface with the interleaved conductive layers in the staircase structure. At least one of the plurality of sections includes a non-flat surface at an interface between the at least one of the plurality of sections and a corresponding conductive layer.


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