The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2024
Filed:
Dec. 18, 2019
Commissariat À L'energie Atomique ET Aux Energies Alternatives, Paris, FR;
Jean Rottner, Grenoble, FR;
Helge Haas, Grenoble, FR;
Abstract
The present description concerns a method of manufacturing a semiconductor component (), including the successive steps of: providing a stack including a first semiconductor layer () made of a III-N compound and a second conductive layer () coating the first layer; forming a trench () crossing the second layer () and stopping on the first layer (), said trench laterally delimiting a contact metallization in the second layer (); forming in said trench () a metal spacer () made of a material different from that of the second layer (), in contact with the sides of the contact metallization; and continuing said trench () through at least a portion of the thickness of the first layer ().