The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2024

Filed:

Sep. 21, 2021
Applicant:

Changxin Memory Technologies, Inc., Hefei, CN;

Inventors:

Jun Xia, Hefei, CN;

Shijie Bai, Hefei, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76831 (2013.01); H01L 21/76816 (2013.01); H01L 21/76877 (2013.01); H01L 2221/1063 (2013.01);
Abstract

Provided is a formation method of a semiconductor structure, including: providing a substrate having a first region and a second region, a plurality of discrete through holes being formed in the substrate, an arrangement density of the through holes in the first region being greater than that in the second region; forming a sacrificial layer filling the through holes; etching some thickness of the substrate around the sacrificial layer to form openings, the openings surrounding the sacrificial layer, a depth of the opening being less than a depth of the through hole in a direction perpendicular to a surface of the substrate; and removing the sacrificial layer, the openings communicating with the corresponding through holes to form trenches.


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