The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2024

Filed:

Dec. 30, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Andreas Wolter, Regensburg, DE;

Thorsten Meyer, Regensburg, DE;

Gerhard Knoblinger, Villach, AT;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 17/00 (2006.01); H01F 41/04 (2006.01); H01L 23/00 (2006.01); H01L 23/522 (2006.01); H01L 23/64 (2006.01); H01F 27/28 (2006.01);
U.S. Cl.
CPC ...
H01F 17/0033 (2013.01); H01F 41/046 (2013.01); H01L 23/5227 (2013.01); H01L 23/645 (2013.01); H01L 24/17 (2013.01); H01F 2017/0086 (2013.01); H01F 2027/2814 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/03464 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/11 (2013.01); H01L 2224/1132 (2013.01); H01L 2224/11334 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/16265 (2013.01); H01L 2224/16267 (2013.01); H01L 2224/1703 (2013.01); H01L 2224/171 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19104 (2013.01); H01L 2924/19107 (2013.01);
Abstract

Embodiments of the invention include a microelectronic device and methods of forming a microelectronic device. In an embodiment the microelectronic device includes a semiconductor die and an inductor that is electrically coupled to the semiconductor die. The inductor may include one or more conductive coils that extend away from a surface of the semiconductor die. In an embodiment each conductive coils may include a plurality of traces. For example, a first trace and a third trace may be formed over a first dielectric layer and a second trace may be formed over a second dielectric layer and over a core. A first via through the second dielectric layer may couple the first trace to the second trace, and a second via through the second dielectric layer may couple the second trace to the third trace.


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