The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2024
Filed:
Jan. 24, 2023
Applied Materials, Inc., Santa Clara, CA (US);
Paul R. McHugh, Kalispell, MT (US);
Gregory J. Wilson, Kalispell, MT (US);
Kyle M. Hanson, Kalispell, MT (US);
John L. Klocke, Kalispell, MT (US);
Paul Van Valkenburg, Whitefish, MT (US);
Eric J. Bergman, Kalispell, MT (US);
Adam Marc McClure, Kalispell, MT (US);
Deepak Saagar Kalaikadal, Kalispell, MT (US);
Nolan Layne Zimmerman, Kalispell, MT (US);
Michael Windham, Kalispell, MT (US);
Mikael R. Borjesson, Lakeside, MT (US);
APPLIED Materials, Inc., Santa Clara, CA (US);
Abstract
An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.