The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2024
Filed:
Oct. 27, 2021
Applicant:
Tokyo Ohka Kogyo Co., Ltd., Kanagawa, JP;
Inventors:
Isao Hirano, Kawasaki, JP;
Yasuo Suzuki, Kawasaki, JP;
Assignee:
TOKYO OHKA KOGYO CO., LTD., Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C11D 3/39 (2006.01); C11D 1/00 (2006.01); C11D 1/22 (2006.01); C11D 3/00 (2006.01); C11D 3/04 (2006.01); C11D 3/10 (2006.01); C11D 3/20 (2006.01); C11D 3/28 (2006.01); C11D 3/395 (2006.01);
U.S. Cl.
CPC ...
C11D 1/22 (2013.01); C11D 1/00 (2013.01); C11D 3/0094 (2013.01); C11D 3/04 (2013.01); C11D 3/10 (2013.01); C11D 3/2075 (2013.01); C11D 3/2079 (2013.01); C11D 3/2082 (2013.01); C11D 3/2086 (2013.01); C11D 3/28 (2013.01); C11D 3/3902 (2013.01); C11D 3/3942 (2013.01); C11D 2111/22 (2024.01);
Abstract
Provided is a cleaning composition for a component of a semiconductor manufacturing process chamber including: a foaming agent; an oxidizing agent; and an acidic compound, in which a value of (Number of moles of the acidic compound contained in the cleaning composition×acid valence of the acidic compound)/(Number of moles of the foaming agent contained in the cleaning composition×Base valence of the foaming agent) is more than 0.1 and less than 1.5.