The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2024

Filed:

Jul. 07, 2022
Applicant:

Corning Incorporated, Corning, NY (US);

Inventors:

Robert Alan Bellman, Ithaca, NY (US);

Shandon Dee Hart, Elmira, NY (US);

Jenny Kim, Horseheads, NY (US);

Karl William Koch, III, Elmira, NY (US);

James Joseph Price, Corning, NY (US);

Hannah Shenouda, Painted Post, NY (US);

Assignee:

Corning Incorporated, Corning, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/04 (2006.01); B32B 17/06 (2006.01); C03C 17/00 (2006.01); C03C 17/42 (2006.01); C03C 21/00 (2006.01);
U.S. Cl.
CPC ...
C03C 17/42 (2013.01); C03C 17/009 (2013.01); C03C 21/002 (2013.01); C03C 2217/734 (2013.01); C03C 2217/78 (2013.01); C03C 2217/948 (2013.01);
Abstract

An article is described herein that includes: a glass-based substrate comprising opposing major surfaces; a crack mitigating composite over one of the major surfaces, the composite comprising an inorganic element and a polymeric element; and a hard film disposed on the crack mitigating composite comprising an elastic modulus greater than or equal to the elastic modulus of the glass-based substrate. The crack mitigating composite is characterized by an elastic modulus of greater than 30 GPa. Further, the hard film comprises at least one of a metal-containing oxide, a metal-containing oxynitride, a metal-containing nitride, a metal-containing carbide, a silicon-containing polymer, a carbon, a semiconductor, and combinations thereof.


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