The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2024

Filed:

Dec. 02, 2020
Applicant:

Mitsubishi Materials Corporation, Tokyo, JP;

Inventors:

Yoshinobu Nakada, Ageo, JP;

Naoki Rikita, Tokyo, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C01B 33/02 (2006.01); B02C 17/04 (2006.01);
U.S. Cl.
CPC ...
C01B 33/02 (2013.01); B02C 17/04 (2013.01); C01P 2004/54 (2013.01); C01P 2004/61 (2013.01); C01P 2004/62 (2013.01); C01P 2006/12 (2013.01); C01P 2006/40 (2013.01);
Abstract

The present invention provides a fine silicon powder and the like including fine silicon particles having a microscopically measured particle diameter of 1 μm or more and an average circularity determined in accordance with Formula (1) of 0.93 or more, in which an average particle diameter based on volume, which is measured by a laser diffraction scattering method, is in a range of 0.8 μm or more and 8.0 μm or less, an average particle diameter based on number, which is measured by the laser diffraction scattering method, is in a range of 0.100 μm or more and 0.150 μm or less, and a specific surface area, which is measured by a BET method, is in a range of 4.0 m/g or more and 10 m/g or less. Circularity=(4×π×projected area of particle)/peripheral length of particle (1).


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