The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2024

Filed:

Dec. 06, 2021
Applicant:

Disco Corporation, Tokyo, JP;

Inventor:

Kazuki Terada, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23Q 3/157 (2006.01); B24B 45/00 (2006.01); B23Q 3/155 (2006.01);
U.S. Cl.
CPC ...
B23Q 3/157 (2013.01); B24B 45/006 (2013.01); B23Q 2003/155418 (2016.11); Y10T 483/132 (2015.01); Y10T 483/174 (2015.01);
Abstract

A blade replacing device used in a cutting apparatus includes a holding section that detachably holds one surface side of a cutting blade, a moving section that relatively advances and retracts the holding section with holding the cutting blade relative to a spindle in an axial direction of the spindle, and positions the holding section at least at a mounting position at which the other surface of the cutting blade is equal to or less than a predetermined distance from a flange section of a blade mount, and at a released position at which the cutting blade is spaced from the blade mount, and a thickness information acquisition section for acquiring information concerning a thickness of the cutting blade. The mounting position of the holding section is adjusted according to the thickness of the cutting blade acquired by utilizing the thickness information acquisition section.


Find Patent Forward Citations

Loading…