The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2024

Filed:

May. 17, 2018
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Dongming Iu, Union City, CA (US);

Kartik Shah, Saratoga, CA (US);

Norman L. Tam, Cupertino, CA (US);

Matthew Spuller, Belmont, CA (US);

Jau-Jiun Chen, San Jose, CA (US);

Kong Lung Samuel Chan, Newark, CA (US);

Elizabeth Neville, Palo Alto, CA (US);

Preetham Rao, Bangalore, IN;

Abhilash J. Mayur, Salinas, CA (US);

Gia Pham, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); C23C 16/455 (2006.01); C23C 16/458 (2006.01); C23C 16/46 (2006.01); C23C 16/56 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67103 (2013.01); C23C 16/45565 (2013.01); C23C 16/4583 (2013.01); C23C 16/46 (2013.01); C23C 16/56 (2013.01); H01L 21/6719 (2013.01); H01L 21/68735 (2013.01); H01L 21/68742 (2013.01); H01L 21/6875 (2013.01); H01L 21/68792 (2013.01); H01L 21/67098 (2013.01);
Abstract

Embodiments of the disclosure generally relate to a semiconductor processing chamber. In one embodiment, semiconductor processing chamber is disclosed and includes a chamber body having a bottom and a sidewall defining an interior volume, the sidewall having a substrate transfer port formed therein, and one or more absorber bodies positioned in the interior volume in a position opposite of the substrate transfer port.


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