The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2024

Filed:

Jul. 28, 2020
Applicant:

Disco Corporation, Tokyo, JP;

Inventor:

Masaru Nakamura, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); B23K 26/03 (2006.01); B23K 26/53 (2014.01); G06T 7/00 (2017.01); G08B 21/18 (2006.01); H01L 21/683 (2006.01); B23K 103/00 (2006.01); H01L 21/268 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67092 (2013.01); B23K 26/032 (2013.01); B23K 26/53 (2015.10); G06T 7/001 (2013.01); G08B 21/182 (2013.01); H01L 21/67115 (2013.01); H01L 21/6836 (2013.01); B23K 2103/56 (2018.08); G06T 2207/30148 (2013.01); H01L 21/268 (2013.01); H01L 21/78 (2013.01); H01L 2221/68327 (2013.01);
Abstract

A control unit of a laser processing apparatus includes: a reference image storage section that images streets before formation of modified layers by an imaging unit and stores the captured image as a reference image; a calculation section that compares the reference image stored in the reference image storage section with an image of a wafer held by a chuck table that is captured by the imaging unit, and calculates the degree of agreement of the two images; and a decision section that decides whether the wafer is an unprocessed wafer not formed with the modified layers in the case where the degree of agreement calculated by the calculation section is more than a first predetermined value, and decides whether the wafer is a processed wafer formed with the modified layers in the case where the degree of agreement is equal to or less than a second predetermined value.


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