The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2024

Filed:

Nov. 30, 2021
Applicant:

Winbond Electronics Corp., Taichung, TW;

Inventors:

Chung-Ming Yang, Taichung, TW;

Shu-Ming Li, Taichung, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 12/00 (2023.01);
U.S. Cl.
CPC ...
H10B 12/09 (2023.02); H10B 12/0335 (2023.02); H10B 12/315 (2023.02); H10B 12/50 (2023.02);
Abstract

Provided is a memory device including a substrate, a plurality of landing pads, a protective layer, a filling layer, a plurality of cup-shaped lower electrodes, a capacitor dielectric layer, and an upper electrode. The landing pads are disposed on the substrate. The protective layer conformally covers sidewalls of the landing pads. The filling layer is laterally disposed between the landing pads, wherein the filling layer has a top surface higher than a top surface of the landing pads. The cup-shaped lower electrodes are respectively disposed on the landing pads. The capacitor dielectric layer covers a surface of the cup-shaped lower electrodes. The upper electrode covers a surface of the capacitor dielectric layer. A method of forming a memory device is also provided.


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