The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2024

Filed:

Apr. 12, 2023
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Sreenivasan Kalyani Koduri, Dallas, TX (US);

Leslie Edward Stark, Heath, TX (US);

Steven Alfred Kummerl, Carrollton, TX (US);

Wai Lee, Dallas, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/14 (2006.01); H01L 23/29 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/31 (2013.01); H01L 21/565 (2013.01); H01L 23/142 (2013.01); H01L 23/293 (2013.01); H01L 23/564 (2013.01); H01L 25/0655 (2013.01);
Abstract

In some examples, a sensor package includes a semiconductor die having a sensor; a mold compound covering a portion of the semiconductor die; and a cavity formed in a top surface of the mold compound, the sensor being in the cavity. The sensor package includes an adhesive abutting the top surface of the mold compound, and a semi-permeable film abutting the adhesive and covering the cavity. The semi-permeable film is approximately flush with at least four edges of the top surface of the mold compound.


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