The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2024

Filed:

Aug. 04, 2021
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventor:

Michael G. Placke, McKinney, TX (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); G06F 3/06 (2006.01); H05K 7/14 (2006.01);
U.S. Cl.
CPC ...
H05K 7/1492 (2013.01); G06F 3/0688 (2013.01); H05K 1/181 (2013.01); H05K 2201/10159 (2013.01);
Abstract

Memory devices including a substrate supporting at least one semiconductor device thereon. The substrate includes an interface sized, shaped, and configured to provide electrical connection to the at least one semiconductor device, the interface located proximate to an end of the substrate. Engagement structures are located proximate to, and laterally outward from, the interface. The engagement structures extend laterally beyond a remainder of a lateral periphery of the substrate, each engagement structure comprising a first depth at a first portion of the engagement structure and a second, smaller depth at a second, laterally inward portion of the engagement structure. A carrier includes supports shaped, positioned, and configured to be positioned in the second portions of the engagement structures to secure the end of the substrate to the carrier.


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