The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2024
Filed:
Aug. 17, 2021
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventor:
Anton J. Devilliers, Clifton Park, NY (US);
Assignee:
Tokyo Electron Limited, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); G03F 9/00 (2006.01); G06T 7/00 (2017.01); G06T 7/33 (2017.01); G06T 7/73 (2017.01); G06V 10/24 (2022.01); H01L 21/66 (2006.01); H01L 23/544 (2006.01); G01N 21/956 (2006.01); H04N 23/56 (2023.01);
U.S. Cl.
CPC ...
G03F 7/70633 (2013.01); G03F 7/70466 (2013.01); G03F 7/7065 (2013.01); G03F 7/70683 (2013.01); G03F 7/7085 (2013.01); G03F 9/7046 (2013.01); G03F 9/7073 (2013.01); G03F 9/7084 (2013.01); G03F 9/7088 (2013.01); G06T 7/001 (2013.01); G06T 7/337 (2017.01); G06T 7/74 (2017.01); G06V 10/245 (2022.01); H01L 22/20 (2013.01); H01L 23/544 (2013.01); G01N 21/95607 (2013.01); G06T 2207/10048 (2013.01); G06T 2207/10152 (2013.01); G06T 2207/30148 (2013.01); G06V 2201/06 (2022.01); H01L 2223/54426 (2013.01); H04N 23/56 (2023.01);
Abstract
A method of processing a wafer is provided. The method includes providing a reference pattern for patterning a wafer. The reference pattern is independent of a working surface of the wafer. A placement of a first pattern on the working surface of the wafer is determined by identifying the reference pattern to align the first pattern. The first pattern is formed on the working surface of the wafer based on the placement.