The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2024
Filed:
Dec. 14, 2020
Applicant:
Agc Inc., Tokyo, JP;
Inventors:
Mamoru Isobe, Tokyo, JP;
Kohei Horiuchi, Tokyo, JP;
Assignee:
AGC Inc., Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/384 (2014.01); B23K 26/0622 (2014.01); B23K 26/402 (2014.01); B23K 26/50 (2014.01); B23K 103/00 (2006.01); C03C 15/00 (2006.01);
U.S. Cl.
CPC ...
B23K 26/384 (2015.10); B23K 26/0624 (2015.10); B23K 26/402 (2013.01); B23K 26/50 (2015.10); C03C 15/00 (2013.01); B23K 2103/54 (2018.08);
Abstract
A glass substrate for a semiconductor package includes a first principal surface, a second principal surface, at least one hollowed-out portion, and at least one through hole formed in a surrounding of the at least one hollowed-out portion, wherein in a section of the at least one hollowed-out portion taken in a direction perpendicular to the first principal surface, a minimum diameter of the at least one hollowed-out portion is smaller than an opening diameter of the at least one hollowed-out portion at each of the first principal surface and the second principal surface.