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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11961825 B1

PDFFull Text
Date of Patent:
Apr. 16, 2024

Filed:

Jun. 07, 2022

Microelectronic device assemblies and packages including multiple device stacks and related methods

Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Aparna U. Limaye, Boise, ID (US);

Dong Soon Lim, Boise, ID (US);

Randon K. Richards, Kuna, ID (US);

Owen R. Fay, Meridian, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:

TraskBritt

Primary Examiner:

Niki H Nguyen

Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 21/66 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 23/64 (2006.01); H01L 23/66 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); H01L 25/18 (2023.01); H01Q 1/22 (2006.01); H01Q 1/48 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/78 (2013.01); H01L 22/12 (2013.01); H01L 23/552 (2013.01); H01L 23/645 (2013.01); H01L 23/66 (2013.01); H01L 24/08 (2013.01); H01L 24/80 (2013.01); H01L 25/0652 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/48 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2225/06531 (2013.01); H01L 2225/06537 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06586 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1443 (2013.01); H01L 2924/14511 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3025 (2013.01);
Abstract

Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more stacks of microelectronic devices are located on the substrate, and microelectronic devices of the stacks are connected to vertical conductive paths external to the stacks and extending to the substrate and to lateral conductive paths extending between the stacks. Methods of fabrication are also disclosed.

Find Patent Forward Citations

Limaye, Aparna. (2024). Microelectronic device assemblies and packages including multiple device stacks and related methods (U.S. Patent No. 11961825). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11961825

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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