The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2024
Filed:
Aug. 27, 2020
Nanjing University of Science and Technology, Jiangsu, CN;
Chao Zuo, Nanjing, CN;
Jiaming Qian, Nanjing, CN;
Qian Chen, Nanjing, CN;
Shijie Feng, Nanjing, CN;
Tianyang Tao, Nanjing, CN;
Yan Hu, Nanjing, CN;
Wei Yin, Nanjing, CN;
Liang Zhang, Nanjing, CN;
Kai Liu, Nanjing, CN;
Shuaijie Wu, Nanjing, CN;
Mingzhu Xu, Nanjing, CN;
Jiaye Wang, Nanjing, CN;
NANJING UNIVERSITY OF SCIENCE AND TECHNOLOGY, Nanjing, CN;
Abstract
Disclosed is a high-precision dynamic real-time 360-degree omnidirectional point cloud acquisition method based on fringe projection. The method comprises: firstly, by means of the fringe projection technology based on a stereoscopic phase unwrapping method, and with the assistance of an adaptive dynamic depth constraint mechanism, acquiring high-precision three-dimensional (3D) data of an object in real time without any additional auxiliary fringe pattern; and then, after a two-dimensional (2D) matching points optimized by the means of corresponding 3D information is rapidly acquired, by means of a two-thread parallel mechanism, carrying out coarse registration based on Simultaneous Localization and Mapping (SLAM) technology and fine registration based on Iterative Closest Point (ICP) technology. By means of the invention, low-cost, high-speed, high-precision, unconstrained and rapid-feedback omnidirectional 3D real-time molding becomes possible, and a new gate is opened into the fields of 360-degree workpiece 3D surface defect detection, rapid reverse forming, etc.