The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2024
Filed:
Apr. 25, 2019
Applicant:
Ebara Corporation, Tokyo, JP;
Inventors:
Assignee:
EBARA CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 37/005 (2012.01);
U.S. Cl.
CPC ...
B24B 37/005 (2013.01);
Abstract
The present invention relates to a polishing apparatus having a surface-property measuring device for measuring surface properties of a polishing pad which is used to polish a substrate, such as semiconductor wafer, and a polishing system including such a polishing apparatus. The polishing apparatus includes a surface-property measuring device () for measuring surface properties of a polishing pad (), a support arm () for supporting the surface-property measuring device (), and a moving unit () coupled to the support arm () and configured to move the surface-property measuring device () from a retreat position to a measure position.