The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2024

Filed:

May. 05, 2022
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Kevin Kashefi, San Ramon, CA (US);

Xiaodong Wang, San Jose, CA (US);

Suhas Bangalore Umesh, Sunnyvale, CA (US);

Zheng Ju, Sunnyvale, CA (US);

Jiajie Cen, San Jose, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/34 (2006.01); C23C 14/34 (2006.01); C23C 14/35 (2006.01);
U.S. Cl.
CPC ...
C23C 14/351 (2013.01); C23C 14/345 (2013.01); C23C 14/3485 (2013.01); H01J 37/3405 (2013.01); H01J 37/3458 (2013.01); H01J 37/3467 (2013.01);
Abstract

Methods and apparatus for processing a substrate are provided herein. For example, a physical vapor deposition processing chamber comprises a chamber body defining a processing volume, a substrate support disposed within the processing volume and comprising a substrate support surface configured to support a substrate, a power supply configured to energize a target for sputtering material toward the substrate, an electromagnet operably coupled to the chamber body and positioned to form electromagnetic filed lines through a sheath above the substrate during sputtering for directing sputtered material toward the substrate, and a controller operably coupled to the physical vapor deposition processing chamber for controlling the electromagnet based on a recipe comprising a pulsing schedule for pulsing the electromagnet during operation to control directionality of ions relative to a feature on the substrate.


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