The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2024
Filed:
Feb. 08, 2019
Applicant:
Lintec Corporation, Tokyo, JP;
Inventors:
Assignee:
LINTEC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); B22F 1/052 (2022.01); B22F 1/054 (2022.01); B22F 1/10 (2022.01); B22F 1/17 (2022.01); B22F 5/00 (2006.01); B22F 7/04 (2006.01); C09J 7/38 (2018.01);
U.S. Cl.
CPC ...
H01L 23/49513 (2013.01); B22F 1/052 (2022.01); B22F 1/054 (2022.01); B22F 1/056 (2022.01); B22F 1/10 (2022.01); B22F 5/006 (2013.01); B22F 7/04 (2013.01); B22F 1/17 (2022.01); C09J 7/38 (2018.01);
Abstract
A film-shaped firing material () is provided, including first metal particles (), second metal particles (), and a binder component (), in which the average particle diameter of the first metal particles () is 100 nm or less, and the maximum particle diameter thereof is 250 nm or less, the average particle diameter of the second metal particles () is in a range of 1000 to 7000 nm, the minimum particle diameter thereof is greater than 250 nm, and the maximum particle diameter thereof is 10000 nm or less, and the mass ratio of the first metal particles to the second metal particles is 0.1 or greater.