The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2024

Filed:

Feb. 17, 2022
Applicant:

Nuvoton Technology Corporation Japan, Kyoto, JP;

Inventors:

Kazuhiko Ohhashi, Osaka, JP;

Masatoshi Kamitani, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 1/07 (2006.01); H03F 1/02 (2006.01); H03F 1/26 (2006.01); H03F 3/24 (2006.01);
U.S. Cl.
CPC ...
H03F 3/245 (2013.01); H03F 1/0288 (2013.01); H03F 1/26 (2013.01); H03F 2200/451 (2013.01); H03F 2203/21127 (2013.01);
Abstract

A radio-frequency power amplifier device includes: a carrier amplifier semiconductor device and a peak amplifier semiconductor device on a multilayer submount substrate; a bias power supply semiconductor device; second radio-frequency signal wiring that transmits a radio-frequency signal to the carrier amplifier semiconductor device and the peak amplifier semiconductor device; and carrier-amplifier bias power supply wiring that is wired in a third wiring layer and supplies a bias power supply voltage. The second radio-frequency signal wiring and the carrier-amplifier bias power supply wiring intersect in a plan view. The radio-frequency power amplifier device includes: a shield pattern that is located in a second wiring layer between a first wiring layer and the third wiring layer; and one or more connection vias disposed in an extension direction of the carrier-amplifier bias power supply wiring. The one or more connection vias are connected to the shield pattern.


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