The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2024
Filed:
Aug. 25, 2021
Micron Technology, Inc., Boise, ID (US);
Matthew B. Leslie, Boise, ID (US);
Timothy M. Hollis, Meridian, ID (US);
Scott R. Cyr, Boise, ID (US);
Stephen F. Moxham, Boise, ID (US);
Matthew A. Prather, Boise, ID (US);
Scott Smith, Plano, TX (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
Apparatuses, such as semiconductor device packages, may include, for example, a device substrate including a semiconductor material and bond pads coupled with an active surface of the device substrate. A package substrate may be secured to the device substrate, the package substrate configured to route signals to and from the bond pads. A ball grid array may be supported on, and electrically connected to, the package substrate. Each ball of the ball grid array positioned and configured to carry a clock signal or a strobe signal may be located in a central column of the ball grid array.