The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2024

Filed:

Apr. 20, 2021
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Bahman Hekmatshoartabari, White Plains, NY (US);

Takashi Ando, Eastchester, NY (US);

Nanbo Gong, White Plains, NY (US);

Alexander Reznicek, Troy, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); G01K 7/02 (2021.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 23/345 (2013.01); G01K 7/021 (2013.01); H01L 23/5226 (2013.01);
Abstract

An embodiment of the invention may include a semiconductor structure, method of use and method of manufacture. The structure may include a heating element located underneath a temperature-controlled portion of the device. A method of operating the semiconductor device may include providing current to a thin film heater located beneath a temperature-controlled region of the semiconductor device. The method may include performing temperature dependent operations in the temperature-controlled region.


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