The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2024

Filed:

Oct. 30, 2020
Applicants:

Carl Zeiss Microscopy Gmbh, Jena, DE;

SD Optics, Inc., Seocho-gu, KR;

Stereo Display, Inc., Anaheim, CA (US);

Inventors:

Alexander Gaiduk, Jena, DE;

Jin Young Sohn, Fullerton, CA (US);

Gyoungil Cho, Fullerton, CA (US);

Cheong Soo Seo, Brea, CA (US);

Assignees:

CARL ZEISS MICROSCOPY GMBH, Jena, DE;

SD OPTICS, INC., Seoul, KR;

STEREO DISPLAY, INC, Anaheim, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02B 21/12 (2006.01); G02B 21/00 (2006.01); G02B 26/08 (2006.01);
U.S. Cl.
CPC ...
G02B 21/125 (2013.01); G02B 21/0032 (2013.01); G02B 26/0833 (2013.01);
Abstract

The present invention concerns an image conversion module () that comprises an optical interface () for establishing an optical path (). The image conversion module () further comprises a beam splitting element () on the optical path (). The beam splitting element () is configured for splitting a beam entering the optical interface () on the optical path () into a first optical subpath () and a second optical subpath (). The image conversion module () further comprises a microelectromechanical optical system () that is configured for enhancing a depth of field on the first optical subpath () that is directed to a first optoelectronic submodule (). The image conversion module () further comprises a second optoelectronic submodule () having an electronic sensor () on the second optical subpath (). The second optoelectronic submodule () is configured for acquiring additional data on the sample ().


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