The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2024

Filed:

Jan. 09, 2023
Applicant:

Advantest Test Solutions, Inc., San Jose, CA (US);

Inventors:

Samer Kabbani, San Jose, CA (US);

Kazuyuki Yamashita, San Jose, CA (US);

Ikeda Hiroki, San Jose, CA (US);

Ira Leventhal, San Jose, CA (US);

Mohammad Ghazvini, San Jose, CA (US);

Paul Ferrari, San Jose, CA (US);

Karthik Ranganathan, San Jose, CA (US);

Gregory Cruzan, San Jose, CA (US);

Gilberto Oseguera, San Jose, CA (US);

Assignee:

Advantest Test Solutions, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2891 (2013.01); G01R 31/2875 (2013.01); G01R 31/2877 (2013.01); G01R 31/2889 (2013.01);
Abstract

An apparatus for thermal control of a device under test (DUT) includes a cooling structure operable to provide cooling, the cooling structure operable to inlet cooling material via an inlet port thereof and operable to outlet cooling material via an outlet port thereof, a variable thermal conductance material (VTCM) layer disposed on a surface of the cooling structure, and a heater layer operable to generate heat based on an electronic control, and wherein the VTCM layer is operable to transfer cooling from the cooling structure to the heater layer. A thermal interface material layer is disposed on the heater layer. The thermal interface material layer is operable to provide thermal coupling and mechanical compliance with respect to the DUT. The apparatus includes a compression mechanism for providing compression to the VTCM layer to vary a thermal conductance of the VTCM layer. The compression mechanism is also for decoupling the VTCM layer from the heater layer.


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