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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11938660 B1

PDFFull Text
Date of Patent:
Mar. 26, 2024

Filed:

May. 14, 2020

Mold die, resin molding apparatus, and method for producing resin molded product

Applicant:

Towa Corporation, Kyoto, JP;

Inventors:

Makoto Tsukiyama, Kyoto, JP;

Atsushi Morikami, Kyoto, JP;

Kosuke Araki, Kyoto, JP;

Assignee:

TOWA CORPORATION, Kyoto, JP;

Attorney:

Dilworth & Barrese, LLP

Primary Examiner:

Benjamin A Schiffman

Int. Cl.
CPC ...
B29C 45/02 (2006.01); B29C 33/00 (2006.01); B29C 33/20 (2006.01); B29C 33/38 (2006.01); B29C 45/00 (2006.01); B29C 45/03 (2006.01); B29C 45/14 (2006.01); B29C 45/26 (2006.01); B29C 45/56 (2006.01); H01L 21/56 (2006.01); B29C 33/02 (2006.01);
U.S. Cl.
CPC ...
B29C 45/02 (2013.01); B29C 33/0061 (2013.01); B29C 33/0077 (2013.01); B29C 33/202 (2013.01); B29C 33/38 (2013.01); B29C 45/0046 (2013.01); B29C 45/03 (2013.01); B29C 45/14 (2013.01); B29C 45/14639 (2013.01); B29C 45/26 (2013.01); B29C 45/56 (2013.01); H01L 21/56 (2013.01); B29C 2033/023 (2013.01); B29C 2045/0051 (2013.01); B29C 2045/14852 (2013.01);
Abstract

A mold die includes: a mold die body that is configured to hold an object to be molded, the object including a substrate and a chip mounted in a central area of the substrate, and that has a cavity which is rectangular in a plan view and which is configured to receive a resin material, the mold die body including: a pot for containing the resin material; a gate disposed at one side of the cavity and configured to allow the resin material to flow into the cavity; and a flow-path restricting mechanism that is disposed on both lateral sides of the cavity that are perpendicular to the one side and that is configured to narrow lateral flow paths, the lateral flow paths being flow paths for the resin material flowing through the cavity in which the chip is not disposed.

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