The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2024
Filed:
Jul. 03, 2023
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Sidharth Dalmia, Portland, OR (US);
Zhenguo Jiang, Chandler, AZ (US);
William J. Lambert, Chandler, AZ (US);
Kirthika Nahalingam, San Jose, CA (US);
Swathi Vijayakumar, Folsom, CA (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); G06F 1/16 (2006.01); H01F 5/04 (2006.01); H01L 25/16 (2023.01); H04B 1/40 (2015.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0243 (2013.01); G06F 1/1613 (2013.01); H01F 5/04 (2013.01); H05K 1/028 (2013.01); H05K 1/181 (2013.01); H05K 1/189 (2013.01); G06F 1/1626 (2013.01); G06F 1/163 (2013.01); G06F 2200/1631 (2013.01); H01L 25/16 (2013.01); H04B 1/40 (2013.01); H05K 2201/1006 (2013.01); H05K 2201/10098 (2013.01);
Abstract
Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.