The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 2024

Filed:

Mar. 07, 2022
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Gurtej S. Sandhu, Boise, ID (US);

Marko Milojevic, Boise, ID (US);

John A. Smythe, Boise, ID (US);

Timothy A. Quick, Boise, ID (US);

Sumeet C. Pandey, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/28 (2006.01); H01L 21/67 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/538 (2006.01); H01L 29/40 (2006.01); H01L 29/423 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76843 (2013.01); H01L 21/28247 (2013.01); H01L 21/67069 (2013.01); H01L 21/76814 (2013.01); H01L 21/76853 (2013.01); H01L 21/76855 (2013.01); H01L 23/5226 (2013.01); H01L 23/5228 (2013.01); H01L 23/528 (2013.01); H01L 23/5283 (2013.01); H01L 23/5386 (2013.01); H01L 29/401 (2013.01); H01L 29/4232 (2013.01); H01L 29/66795 (2013.01);
Abstract

A method of forming a structure comprises forming a pattern of elongate features extending vertically from a base structure. Conductive material is formed on the elongate features. After completing the forming of the pattern of elongate features, the elongate features, the conductive material, or both is (are) exposed to at least one surface treatment gas. The at least one surface treatment gas comprises at least one species formulated to diminish attractive or cohesive forces at a surface of the conductive material. Apparatus and additional methods are also described.


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