The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 2024

Filed:

Nov. 09, 2020
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Hung-Chih Ou, Hsinchu, TW;

Wen-Hao Chen, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 30/398 (2020.01); G06F 30/30 (2020.01); G06F 119/06 (2020.01); G06F 119/12 (2020.01);
U.S. Cl.
CPC ...
G06F 30/398 (2020.01); G06F 30/30 (2020.01); G06F 2119/06 (2020.01); G06F 2119/12 (2020.01);
Abstract

A semiconductor device includes a first circuit element, a layer of dielectric material, a first wire and a second wire in the layer of dielectric material, and an array of wires in the layer of dielectric material, wherein a first wire at a first track in the array of wires is electrically connected to the first circuit element, the first wire having a first width, a second wire at a second track in the array of wires has a second width different from the first width, and a third track in the array of wires between the first track and the second track is an empty track, and wherein the first wire is asymmetric with respect to the first track in the array of wires.


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