The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2024
Filed:
Jun. 27, 2020
Intel Corporation, Santa Clara, CA (US);
Jeff Ku, Taipei, TW;
Cora Nien, Changhua County, TW;
Gavin Sung, Taichung, TW;
Tim Liu, New Taipei, TW;
Lance Lin, New Taipei, TW;
Wan Yu Liu, New Taipei, TW;
Gerry Juan, Taipei, TW;
Jason Y. Jiang, Taipei, TW;
Justin M. Huttula, Portland, OR (US);
Evan Piotr Kuklinski, North Plains, OR (US);
Juha Tapani Paavola, Hillsboro, OR (US);
Arnab Sen, Bangalore, IN;
Hari Shanker Thakur, Bangalore, IN;
Prakash Kurma Raju, Bangalore, IN;
Intel Corporation, Santa Clara, CA (US);
Abstract
There is disclosed in one example a heat dissipator for an electronic apparatus, including: a planar vapor chamber having a substantially rectangular form factor, wherein a second dimension dof the rectangular form factor is at least approximately twice a first dimension dof the rectangular form factor; a first fan and second fan; and a first heat pipe and second heat pipe discrete from the planar vapor chamber and disposed along first and second dedges of the planar vapor chamber, further disposed to conduct heat from the first and second dedges to the first and second fan respectively.