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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11929342 B1

PDFFull Text
Date of Patent:
Mar. 12, 2024

Filed:

Oct. 28, 2020

Semiconductor device with leads having step surfaces

Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventors:

Futoshi Tsukada, Nagano, JP;

Yukinori Hatori, Nagano, JP;

Yoshiyuki Sawamura, Nagano, JP;

Assignee:

SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;

Attorney:

Rankin, Hill & Clark LLP

Primary Examiner:

Didarul A Mazumder

Assistant Examiner:

Gustavo G Ramallo

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/29 (2006.01); H01L 23/36 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 24/45 (2013.01); H01L 23/295 (2013.01); H01L 23/36 (2013.01); H01L 23/49861 (2013.01); H01L 23/5386 (2013.01);
Abstract

A semiconductor device includes: a lead frame that is formed of metal; a wiring substrate that is opposed to the lead frame; an electronic component that is disposed between the lead frame and the wiring substrate; a connection member that connects lead frame and the wiring substrate; and encapsulating resin that is filled between the lead frame and the wiring substrate and covers the electronic component and the connection member. The lead frame includes: a first surface opposed to the wiring substrate and covered by the encapsulating resin; a second surface located on a back side of the first surface and exposed from the encapsulating resin; and a side surface neighboring first surface or the second surface, at least a portion of the side surface exposed from the encapsulating resin.

Find Patent Forward Citations

Tsukada, Futoshi. (2024). Semiconductor device with leads having step surfaces (U.S. Patent No. 11929342). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11929342

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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