The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2024
Filed:
Sep. 12, 2019
Tokyo Ohka Kogyo Co., Ltd., Kawasaki, JP;
Tetsuro Kinoshita, Kawasaki, JP;
Teruhiro Uematsu, Kawasaki, JP;
Tokyo Ohka Kogyo Co., Ltd., Kawasaki, JP;
Abstract
A protective film forming agent for plasma dicing which can favorably form an opening (processed groove) of a desired shape by irradiation of a laser beam, at a desired position of the protective film, upon producing semiconductor chips by cutting a semiconductor substrate by plasma dicing, and a method for producing a semiconductor chip using this protective film forming agent. The protective film forming agent comprises a water-soluble resin, a light absorber, and a solvent, and a weight loss rate when the temperature is raised to 500° C. in thermogravimetry of the water-soluble resin is at least 80 weight %.