The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2024
Filed:
Mar. 13, 2023
Corning Incorporated, Corning, NY (US);
Jaymin Amin, Corning, NY (US);
Jason Thomas Harris, Horseheads, NY (US);
Shandon Dee Hart, Elmira, NY (US);
Chang-gyu Kim, Suwon-si, KR;
Karl William Koch, III, Elmira, NY (US);
Carlo Anthony Kosik Williams, Painted Post, NY (US);
Lin Lin, Painted Post, NY (US);
Dong-gun Moon, Yongin-si, KR;
Jeonghong Oh, Cheonan-si, KR;
James Joseph Price, Corning, NY (US);
Charlene Marie Smith, Corning, NY (US);
Ananthanarayanan Subramanian, Corning, NY (US);
Ljerka Ukrainczyk, Ithaca, NY (US);
Tingge Xu, Santa Clara, CA (US);
Corning Incorporated, Corning, NY (US);
Abstract
A transparent article is described herein that includes: a glass-ceramic substrate comprising first and second primary surfaces opposing one another and a crystallinity of at least 40% by weight; and an optical film structure disposed on the first primary surface. The optical film structure comprises a plurality of alternating high refractive index (RI) and low RI layers and a scratch-resistant layer. The article also exhibits an average photopic transmittance of greater than 80% and a maximum hardness of greater than 10 GPa, as measured by a Berkovich Hardness Test over an indentation depth range from about 100 nm to about 500 nm. The glass-ceramic substrate comprises an elastic modulus of greater than 85 GPa and a fracture toughness of greater than 0.8 MPa·√m. Further, the optical film structure exhibits a residual compressive stress of ≥700 MPa and an elastic modulus of ≥140 GPa.