The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2024
Filed:
Jul. 16, 2021
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Chu-Feng Liao, Hsinchu, TW;
Hung-Ping Cheng, Chiayi, TW;
Yuan-Yao Chang, Kaohsiung County, TW;
Shuo-Wen Chang, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
The present disclosure provides a semiconductor wafer. The semiconductor wafer includes: a scribe line between a first row of dies and a second row of dies; and a benchmark circuit disposed adjacent to the scribe line and electrically coupled to a first conductive contact and a second conductive contact. The benchmark circuit includes a first device-under-test (DUT); a second DUT; a first switching circuit configured to selectively couple the first DUT and the second DUT to the first conductive contact; and a second switching circuit configured to selectively couple the first DUT and the second DUT to the second conductive contact.