The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2024
Filed:
Nov. 07, 2022
Applicant:
Disco Corporation, Tokyo, JP;
Inventors:
Yoshinobu Saito, Tokyo, JP;
Jonghyun Ryu, Tokyo, JP;
Assignee:
DISCO CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67265 (2013.01); H01L 21/6773 (2013.01);
Abstract
A warning is issued about an irregularity concerning a wafer stored in a cassette if a difference between a value of an apparent thickness of the wafer and the previously obtained value of an actual thickness of the wafer exceeds a threshold value, the value of the apparent thickness of the wafer being obtained by a non-contact-type sensor for detecting a front portion of the wafer laterally of the wafer. Consequently, the wafer is prevented from being damaged when it is taken out of the cassette.