The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2024

Filed:

Dec. 20, 2020
Applicant:

Semes Co., Ltd., Cheonan-si, KR;

Inventors:

Tae Shin Kim, Suwon-si, KR;

Young Dae Chung, Incheon, KR;

Ji Hoon Jeong, Hwaseong-si, KR;

Jee Young Lee, Incheon, KR;

Won Geun Kim, Goyang-si, KR;

Assignee:

SEMES CO., LTD., Cheonan-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); B08B 3/10 (2006.01); B23K 26/00 (2014.01); B23K 26/06 (2014.01); B23K 26/064 (2014.01); B23K 26/352 (2014.01); G02B 7/02 (2021.01); G02B 27/09 (2006.01); H01L 21/02 (2006.01); H01L 21/268 (2006.01); H01L 21/66 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); B23K 101/40 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67115 (2013.01); B08B 3/10 (2013.01); B23K 26/0006 (2013.01); B23K 26/0604 (2013.01); B23K 26/0626 (2013.01); B23K 26/064 (2015.10); B23K 26/352 (2015.10); G02B 7/028 (2013.01); G02B 27/0916 (2013.01); G02B 27/0955 (2013.01); H01L 21/02057 (2013.01); H01L 21/268 (2013.01); H01L 21/67051 (2013.01); H01L 21/67248 (2013.01); H01L 21/68764 (2013.01); H01L 22/20 (2013.01); B23K 2101/40 (2018.08); B23K 2103/56 (2018.08);
Abstract

Proposed is a substrate heating unit including: a laser generator providing a laser beam for heating a substrate; and a beam shaper processing the laser beam from the laser generator and selectively providing one of a first beam having a uniform energy distribution and a second beam having an edge-enhanced energy distribution to the substrate.


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