The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2024
Filed:
Apr. 27, 2020
Intel Corporation, Santa Clara, CA (US);
Prabhakar Subrahmanyam, San Jose, CA (US);
Casey Winkel, Hillsboro, OR (US);
Yingqiong Bu, Shanghai, CN;
Ming Zhang, Shanghai, CN;
Yuehong Fan, Shanghai, CN;
Yi Xia, Campbell, CA (US);
Ying-Feng Pang, San Jose, CA (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include limiting the degree of tilt experienced by a semiconductor device as a thermal solution coupled to the semiconductor device is tightened to the substrate. Such thermal performance improvements may include increasing the available heat transfer area associated with a particular heat producing semiconductor device. Such thermal performance improvements may include thermally coupling one or more cool blocks thermally coupled to one or more remote heat-producing devices to a central cool block that may be cooled using a cooling medium or coupled to a central heat-producing semiconductor device.