The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2024
Filed:
Sep. 02, 2021
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Yann Mignot, Slingerlands, NY (US);
Christopher J. Waskiewicz, Rexford, NY (US);
Eric Miller, Watervliet, NY (US);
Chanro Park, Clifton Park, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 21/76808 (2013.01); H01L 21/76816 (2013.01); H01L 21/76834 (2013.01); H01L 21/76892 (2013.01); H01L 21/76897 (2013.01); H01L 23/5283 (2013.01);
Abstract
Interconnect structures including super vias are formed during back-end-of-line processing using sacrificial placeholders to protect the bottom portions of the super vias while upper portions of the super vias are formed. The sacrificial placeholders are removed and replaced by metal conductors that fill the bottom and upper portions of the super vias.